SLIGHTLY off topic question here: what fabric would displace heat the best?

[Taverner]

Picture this if you will:

a bunch of Class 10 microSD wafers stitched into a non-conductive, heat displacing fabric, with copper woven in to carry data.

RAID the shit out of these things, and build filesystems on it

You could fit over 1000 of these in less than 1U.

Instead of silicon (which can get hot) you use an airy sturdy fiber casing, lots of airflow, and cheap commodity HW..

Let me put it this way - using Class 10 64G wafers, a file system built on massive redundancy, 1000 (64TB RAW) would cost less than $7K.